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Processing Technology: Delay Pressure Foil
Base Material: Copper
Insulation Materials: Epoxy Resin
Brand: Found
High Layer: 4
Copper Thickness: 1oz
Board Thickness: 1.2mm
Surface Finish: Immersion Gold
Min Width/Space: 3/3mil
Min Hole: 0.2mm
Mask: Green
Silkscreen: White
Trademark: FD
Transport Package: VACUUM PACKING
Specification: 83.14*91.4mm
Origin: Shenzhen

HS Code: 8534009000

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