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Materials used for flex-rigid printed circuit boards: 

• HTE electrolytic copper foil;

• fiberglass cloth FR406N, Isola;

• glass-fiber laminate DE 104, Isola;

• foiled polyimide, Dupont;

• cover polyimide film, Dupont;

• binding polyimide film, Dupont;

• fiberglass RO4350B Rogers;

• fiberglass PREPREG RO4450B Rogers.

Materials used for printed circuit boards on a metallic substrate: 

• foiled aluminum ALCCL-35/0-1.5.

aterials used for printed circuit boards with plated-through-hole vias (1:15) filled with epoxy paste: 

• epoxy paste, Peters.

 
Printed circuit boards are produced using advanced imported equipment. 

Cost and production time of printed circuit boards are agreed after receiving documentation.

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