Polyimide Immersion Gold FPC PCB
General description
This is a type of flexible printed circuit for the application of Monitoring Systems. It's a single layer
FPC at 0.15mm thick. FR-4 as stiffner is used on the bottom side. The base laminate is from ITEQ,
It's fabricated per IPC 6012 Class 2 using supplied Gerber data.
Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Quick and on-time delivery
L. Eligible products rate of first production: >95%
Application
Toy lamp strip,FFC for industrial control equipment,Tablet PC capacitive screen soft board
Parameter and data sheet
Size of Flexible PCB | 55.11 X 42.31mm |
Number of Layers | 1 |
Board Type | Flex PCB |
Board Thickness | 0.15mm |
Board Material | Polyimide 25µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60ºC |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | N/A |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | FR-4 stiffner |
Stiffener Thickness | 1.0mm |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Main flexible PCBs
PCB high speed multihead drilling machine
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