PCBA assembly gold finger edge plating plating gold hard gold
Layer:10 L
Material:FR4
value:tg150
board thickness:1.6mm
copper thickness:1oz
Surface treatment:ENIG + gold plating
Application:electronics products
Our main process capability:
Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmMax. Panel Size520X660mm680X1200mmMin. Mechnical Drill0.2mm0.15mmMin. Line width&space0.1/0.1mm0.076/0.076mmMax. Copper Thickness6 oz8ozMax. Aspect Ratio8:110:1Solder Mask ColorGreen,Black,White,Blue,Red,Matt Green, Matt BlackSilkscreen ColorWhite,Black,Yellow,Grey,OrangeBase MaterialCEM1,CEM3,FR4,IMS,aluminumSurface TreatmentHASL(Lead Free),OSP,ENIG, ENEPIG,Immersion Silver,Immersion Tin, Hard Gold Plating,Tin Plating, Silver Plating Our Lead time:layers1~2layers4layers6layers8layerssample3~4 days5 days6 days7 daysVolume production7~9 days11 days14 days15 days
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