Frame Mounted SMT Stencils Technology used to make the stencils: 100% laser cut Material used: 304 Full Hard Stainless Steel Stencil thickness: 0.12mm - 0.15mm Minimum cut size: 100mm x 100mm, Fixed aluminum frame Aperture tolerance: within0 .0005 mm Manufacturing time: within 24 hour Shiping...
Frame Mounted SMT Stencils
Technology used to make the stencils: 100% laser cut
Material used: 304 Full Hard Stainless Steel
Stencil thickness: 0.12mm - 0.15mm
Minimum cut size: 100mm x 100mm, Fixed aluminum frame
Aperture tolerance: within0 .0005 mm
Manufacturing time: within 24 hour
Shiping Packaging: Separated shipments with PCB order
Apart from all types of Printed Circuit Boards (PCBs) such as Prototype PCB), Standard PCB, Aluminum PCB, HDI PCB, Flexible PCB, Flex-Rigid PCB, High-Frequency PCB, Thick copper PCB, High-Tg PCB and Halogen-Free PCB, Pp also specializes in manufacturing solder paste stencils in order to meet Surface Mount Technology (SMT) requirements.
The purpose of an SMT stencil is to transfer solder paste to a bare circuit board.
A stainless steel foil is laser cut creating an opening for every surface mount device on the board.
Once the stencil is properly aligned on top of the board, solder paste is applied over the openings
When the stainless steel foil is separated from the board, solder paste will remain, ready for placement of the SMD. This process, as opposed to hand soldering methods, ensures consistency and saves time.
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