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Automatic SMT Assembly PCB Industrial Control PCBA

  • Model NO.:FD-12 Mode of Production: SMT Base Material: FR-4 Customized: Customized PCBA-Testing: X-ray,Aoi Type: Rigid Circuit Board Processing Technology: Electrolytic Foil Material: Complex Transport Package: Packed in Carton Origin: China Metal Coating: Copper Layers: Multilayer Certification: RoHS, ISO Condition: New Small Order: Acceptable Flame Retardant Properties: V0 Insulation Materials: Organic Resin Trademark: FOUND Specification: Copper HS Code: 8534009000

Shenzhen Found Printed Circuit Company is a professional PCB manufacturer since 2005, which has been certified ISO 9001-2008, ISO 14001-2004 and ISO/TS 16949-2009. In Aug 2013, our company introduced ERP system, which helped to improve factory operation management. In the past decade, Shenzhen Found Printed Circuit Company provided stable and reliable PCB manufacturing solution to over 1,000 customers from all over the world. 


Stencil also called SMT stencils, play a key role in transferring accurate amount of solder paste to correct positions on bare circuit boards ready for assembly. In other words, stencils can fast and efficiently ensure the most accurate solder paste amount and optimal electrical connection. With solder stencils, it is possible to use metal squeegee blades to apply solder paste easily over the openings on PCBs and make stencil to be well aligned with the surface of the advanced circuit board.


According to SMT stencil manufacturing technologies, we provide  laser-cut stencils.



The purpose of an SMT stencil is to transfer solder paste to a bare circuit board.


A stainless steel foil is laser cut creating an opening for every surface mount device on the board.


Once the stencil is properly aligned on top of the board, solder paste is applied over the openings

When the stainless steel foil is separated from the board, solder paste will remain, ready for placement of the SMD. This process, as opposed to hand soldering methods, ensures consistency and saves time.


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