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PCB capabilities:

· Rigid PCB up to 30 layers

· Flexible PCB up to 6 layers

· Rigid flex PCB up to 20 layers

· Metal based PCB up to 8 layers

· Materials used: FR4, high TG FR4, halogen-free FR4, high-frequency, ceramic, aluminum or copper based, polyimide, PTFE hybrid

· Surface finish: HAL, lead-free HAL, immersion gold, silver, tin, OSP, hard gold-plated, ENEPIG, carbon ink, blue mask

· DHI technology: 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3, stacked vias available

· Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), via in PAD filling, extremely large or thick PCB, microwave and RF circuit boards

DIP capability:
• A-8 of semi-assembly work line with 3 sets wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process

Advantages:
-PCB fabrication and layout
-Components sourcing
-Metal stamping and plastic injection
-PCBA assembly (SMD + DIP assembly)
-PCBA testing (AOI testing, ICT testing, functional testing)
-Turnkey assembly and final testing
-Burn-in testing
-Quick and on-time delivery

Equipment in our PCBA facilities includes:
-Functional, electrical and in-circuit testing equipment
-Optical microscopes
-Multi-functional placement machines
-Full-vision solder printing machines
-Full-vision high-speed pick and place machines
-BTU reflow machines
-Wave soldering machine

Welcome to our cooperation!

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