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SMT FR4 PCB led assembly  Electronic Board

Hole center distance: 2.54MM

Size: 0.95 MM

Thickness: 1.6 MM

Shipment unit: one piece

PCB Manufacturing Capacity:
Base material:FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc
PCBs: Rigid(0-20layers),Flexible(1-8layers),Rigid-flex(1-16layers,flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness: 0.2mm--10mm
Copper thickness: 0.25 Oz -8 Oz
Max Panel Size: 1200 mm × 560 mm
Min. Hole Size: 0.075mm(3mil)
Min. Line Width/Spacing: 3mil
Surface Finishing: HASL/HAL, HASL Lead Free,ENIG,immersion silver,immersion tin,OSP,Plating Hard Gold,etc.
Solder Mask Color: White, Black, Yellow, Green, Red, etc.
Silkscreen Color: Black, White, Yellow, Red, Blue, etc.
Special Process: Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.

PCB Assembly Capacity:
SMT Capability:5KK points/Day,single-sided/double-sided,10 Lines
Reject rate of components: 0.3% (Capacitor and Resistance)No(IC)
Min. Package: 01005 chip / 0.35 Pitch BGA
Min. Precision: +/-0.04mm
Min. Precison of IC: +/-0.03mm
SMD Size:0201-150mm
Max. Height of components by machine:30mm
Min. Pin pitch of SMT: 0.2mm
Min. Ball pitch of SMT: 0.2mm
Min. Precision of Stencil: 5um
PCB Size of Assembly: 5x5mm-500*1500mm
PCB Thickness of Assembly: 0.1-10mm
BGA/μBGA: available;Solder paste/glue processing
DIP capacity: 0.30 million points per day
Max. Capability: Stable support for 200 products on production line at the same time
Functional testing&Casing assembly: upon customer's requirements

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