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PCB Prototype For Computer Parts

  • PCB Prototype For Computer Parts

FD-75
Structure
Multilayer Rigid PCB
Dielectric
FR-4
Material
Polyester Glass Fiber Mat Laminate
Application
Communication
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Organic Resin
Brand
FD
Accreditations
ISO9001/UL/SGS/RoHS
Leadtime
1 Working Days
Min. Line W/S
5/5mil
Min. Hole Diameter
0.2mm
Aspect Ratio
3.3:1
Board Thickness
1.0mm
Copper Thickness
1oz
Surface Finish
OSP
Special Processing
Impedance Control






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