Basic Info Model NO:FD-90 Special Process:Blind Hole Special+Process:Countersunk Hole Trademark:FD PCB Transport Package:Vacuumize Origin:China
Material:Aluminium
thickness:1.6mm
copper: 1/1 oz
solder mask:white
finished surface:HASL-lead free
Thermal conductivity:2W/(m.k)
| Layers | Maximum Layer Count | 1~32 | tolerance |
| Size | Maximum shipping Panel Size | 600mmx550mm | +/-0.15mm |
| Board Thickness | Minimum Board Thickness | 0.4mm (4L)0.6mm (6L) | +/-0.1mm |
| Maximum Board Thickness | 3.6mm | +/-10% | |
| Copper Thickness | 0.5~5 oz | ||
| Via Holes | Minimum Via | 0.2mm | PTH +/-0.075mm |
| Buried Vias | Yes | NPTH +/-0.05mm | |
| Blind Vias | Yes | ||
| Ratio | Maximum Aspect Ratio | 10:01 | |
| Trace | Minimum Line Width (Internal) | 0.075mm | The tolerance followed by IPC-6012 |
| Minimum Line Spacing (Internal) | 0.075mm | ||
| Minimum Line Width (External) | 0.075mm | ||
| Minimum Line Spacing (External) | 0.075mm | ||
| Surface Finish | Selective Soft Gold (MCM) | 0.025~0.1 um | |
| Selective Hard Gold (SIMM) | 0.025~1.0 um | ||
| Immersion Gold (Ni/Au) | 0.025~0.1 um | ||
| HASL | min. 2.5 um | ||
| Lead Free HASL | min. 2.5 um | ||
| OSP (Entek CU106A) | 0.2~0.5 um | ||
| Immersion Tin | min. 0.625 um | ||
| Immersion Silver | min. 0.175 um | ||
| Carbon Ink | Yes | ||
| Other Finish | Peelable mask | ||
| Material | Composite | CEM-1 | |
| CEM-3 | |||
| Glass Fiber | FR-4 | ||
| High Tg FR-4 | |||
| Other Materials | Aluminum, Polyimide | ||
| Solder Mask | LPI | Yes | |
| UV | Yes | ||
| Thermal | Yes | ||
| Reliability | Controlled Impedance/tolerance | Yes | +/- 10% |
| Ionic Contaminant | Yes | max. 1.56 ug/cm2 | |
| Microsection | Yes | ||
| Solderability Test | Yes | ||
| Hi Pot Test | Yes | 500~1000V | |
| Certificate | ISO 9000 | Yes | |
| ISO 14000 | Yes | ||
| TS 16949 | Yes | ||
| UL | Yes | ||
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